THERMAL DESIGN OF MECHATRONIC SYSTEMS

THERMAL DESIGN OF MECHATRONIC SYSTEMS

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Last update 09/05/2021 11:13
Code
94775
ACADEMIC YEAR
2021/2022
CREDITS
6 credits during the 1st year of 9269 Mechanical Engineering - Design and Production (LM-33) GENOVA
SCIENTIFIC DISCIPLINARY SECTOR
ING-IND/10
LANGUAGE
Italian
TEACHING LOCATION
GENOVA (Mechanical Engineering - Design and Production)
semester
1° Semester
modules
This unit is a module of:
Teaching materials

OVERVIEW

Both the aspects related to heat transfer in mechatronic systems and the conditioning of the data centers will be presented during the course. New cooling techniques (jet impingement, heat pipes) as well as new heat transfer fluid (nanofluids and PCMs) will be discussed. The measurement techniques for thermal  quantities will also be presented.

AIMS AND CONTENT

LEARNING OUTCOMES

The module aims to provide analytical and numerical tools to address the thermal design of mechatronic systems, as well as to know the most appropriate thermal measurement methods for these systems.

AIMS AND LEARNING OUTCOMES

Based on the previously stated objective, the student at the end of the module will be able to:

to operate critically on problems of heat transfer
to apply numerical methods in the  heat transfer
to monitor and measure the main thermofluidodynamic quantities (temperature, pressure, speed)
to know new heat transfer fluids (nanofludes, PCM)
to design  heat exchangers
to know the problems of data centers.

Teaching methods

Lessons and numerical applications

SYLLABUS/CONTENT

Heat transfer (conduction, radiation convection). Performance of finned surfaces. Numerical techniques applied to thermal exchange problems. Design of Compact Heat Exchangers (CHE). Heat pipes and jet impingement. HVAC design of  data centers. Nanofluids and phase-passing materials (PCMs). Thermal and fluid measurements.

RECOMMENDED READING/BIBLIOGRAPHY

M. Misale: Schede del corso "PROGETTAZIONE TERMICA DI SISTEMI MECCATRONICI", 2017 (Aulaweb)

Y. A. Cengel, Termodinamica e trasmissione del calore, McGraw-Hill

M. J. Moran, H. N. Shapiro, B. R. Muson, D. P. DeWitt, Elementi di Fisica tecnica per l'ingegneria, McGraw-Hill

A. Bejan: Heat Transfer, J. Wiley & Sons

M. Iyengar, K.J.L. Geisler, B. Sammakia, Cooling of microelectronic and nanoelectronic equipment, WSP

C. C.  Silverstein, Design and Technology of heat pipes for cooling and heat exchange, Hemishpere Publishing Corporation.

S. Kacas, H. Liu, A. Pramuanjaroenkij, Heat exchangers, CRC press

TEACHERS AND EXAM BOARD

Ricevimento: appointment: mario.misale@unige.it

LESSONS

Teaching methods

Lessons and numerical applications

ORARI

L'orario di tutti gli insegnamenti è consultabile su EasyAcademy.

EXAMS

Exam description

The examination will be oral. A written report will also be given by the teacher before the end of the course.

 

For disabled students and students with SLD, it is possible to request the application of art. 29 paragraph 4 of the University Didactic Regulations

Assessment methods

The examination will be oral. A written report will also be given by the teacher before the end of the course.

 

For disabled students and students with SLD, it is possible to request the application of art. 29 paragraph 4 of the University Didactic Regulations